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datashee t product structure silicon integrated circuit this product is not designed protection against radioactive rays . 1/35 tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.co 23.jan.2014 rev.002 gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic isolation BM6104FV-C general description the BM6104FV-C is a gate driver with isolation voltage 2500vrms, i/o delay time of 150ns, and minimum input pulse width of 90ns, and incorporates the fault signal output functions, undervoltage lockout (uvlo) function, and short current protection (scp, desat) function. features ? providing galvanic isolation ? active miller clamping ? fault signal output function (adjustable output holding time) ? undervoltage lockout function ? short current protection function (adjustable reset time) ? soft turn-off function for short current protection (adjustable turn-off time) ? supporting negative vee2 ? output state feedback function ? aec-q100 qualified applications ? igbt gate driver ? mosfet gate driver key specifications ? isolation voltage: 2500vrms ? maximum gate drive voltage: 24v ? i/o delay time: 150ns(max) ? minimum input pulse width: 90ns(max) package w(typ) x d(typ) x h(max) ssop-b20w 6.50mm x 8.10mm x 2.01mm typical application circuits figure 1. for using 4-pin igbt (for using scp function) figure 2. for using 3-pin igbt (for using desat function) proout vee2 out1l out1h vcc2 vreg out2 gnd2 vee2 scpin gnd1 osfb inb fltrls vcc1 flt ina ena test gnd1 s q r uvlo flt time r logic s q r fb regulator + - uvlo latch ina ena + - + - logic proout vee2 out1l out1h vcc2 vreg out2 gnd2 vee2 scpin gnd1 osfb inb fltrls vcc1 flt ina ena test gnd1 s q r uvlo flt time r logic s q r fb + - + - re g ulato r + - uvlo logic latch ina ena 1 p in 1 p in
2/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 recommended range of external constants pin name symbol recommended value unit min typ max fltrls c fltrls - 0.01 0.47 f r fltrls 50 200 1000 k ? vreg c vreg 1.0 3.3 10.0 f vcc1 c vcc1 0.1 1.0 - f vcc2 c vcc2 0.33 - - f pin configurations pin descriptions pin no. pin name function 1 scpin short current detection pin 2 vee2 output-side negative power supply pin 3 gnd2 output-side ground pin 4 out2 mosfet control pin for miller clamp 5 vreg power supply pin for driving mosfet for miller clamp 6 vcc2 output-side positive power supply pin 7 out1h source side output pin 8 out1l sink side output pin 9 vee2 output-side negative power supply pin 10 proout soft turn-off pin 11 gnd1 input-side ground pin 12 osfb output state feedback output pin 13 inb control input pin b 14 fltrls fault output holding time setting pin 15 vcc1 input-side power supply pin 16 flt fault output pin 17 ina control input pin a 18 ena input enabling signal input pin 19 test test mode setting pin 20 gnd1 input-side ground pin (top view) gnd1 sc pin 20 1 test v ee2 19 2 en a g nd2 18 3 ina ou t2 17 4 flt v re g 16 5 v cc1 v cc2 15 6 fltrls o u t1h 14 7 inb out1l 8 osfb v ee2 12 9 gnd1 proout 11 10 13
3/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 description of pins and cautions on layout of board 1) vcc1 (input-side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppr ess voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the vcc1 and the gnd1 pins. 2) gnd1 (input-side ground pin) the gnd1 pin is a ground pin on the input side. 3) vcc2 (output-side positive power supply pin) the vcc2 pin is a positive power supply pin on the output side. to reduce voltage fluctuations due to out1h/l pin output current and due to the current to drive internal tran sformers, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4) vee2 (output-side negative power supply pin) the vee2 pin is a power supply pin on the output side. to su ppress voltage fluctuations due to out1h/l pin output current and due to the current to drive internal transformers, c onnect a bypass capacitor between the vee2 and the gnd2 pins. to use no negative power supply, connect the vee2 pin to the gnd2 pin. 5) gnd2 (output-side ground pin) the gnd2 pin is a ground pin on the out put side. connect the gnd2 pin to the emitter / source of a power device. 6) in (control input terminal) the in is a pin used to determine output logic. ena inb ina out1h out1l h x x hi-z l l h l hi-z l l h h hi-z l l l l hi-z l l l h h hi-z 7) flt (fault output pin) the flt pin is an open drain pin used to output a fault signa l when a fault occurs (i.e., when the undervoltage lockout function (uvlo) or short current protection function (scp) is activated). pin flt while in normal operation hi-z when an fault occurs (when uvlo or scp is activated) l 8) fltrls (fault output holding time setting pin) the fltrls is a pin used to make setting of time to hold a fault signal. connect a capacitor between the fltrls pin and the gnd1 pin, and a resistor between it and the vcc1 pin. the fault signal is held until the fltrls pin voltage exceeds a voltage set with the v fltrls parameter. to set holding time to 0 ms, do not connect the capacito r. short-circuiting the fltrls pin to t he vcc1 pin will cause a high current to flow in the fltrls pin and, in an open state, may cause the ic to malfunction. to avoid such trouble, be sure to connect a resistor between the fltrls and the vcc1 pins. 9) out1h, out1l (output pin) the out1h pin is a source side pin used to drive the gate of a power device, and the out1l pin is a sink side pin used to drive the gate of a power device. 10) out2 (mosfet control pin for miller clamp) the out2 is a pin for controlling the external mos switch to prevent the increase in gate voltage due to the miller current of the power device connected to out1h/l pin. 11) vreg (power supply pin for driving the mosfet for miller clamp) the vreg pin is a power supply pin for miller clamp (typ 10v). be sure to connect a capacitor between vreg pin and vee2 pin to prevent oscillation and to reduce voltag e fluctuations due to out2 pin output current. 12) proout (soft turn-off pin) the proout is a pin used to put the soft turn-off function of a power device in operation when the scp function is activated. this pin combines with the gate voltage monito ring pin for miller clamp function and osfb function which output the gate state. 13) scpin (short current detection pin) the scpin is a pin used to detect current for short cu rrent protection. when the scpin pin voltage exceeds v scdet (typ 0.7v), the scp function will be activated. this may ca use the ic to malfunction in an open state. to avoid such trouble, short-circuit the scpin pin to t he gnd2 pin if the short current protecti on is not used. in order to prevent the wrong detection due to noise, the noise mask time t scpmsk (typ 0.8s) is set.
4/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 14) osfb (output stat e feedback output pin) the osfb pin is an open drain pin used to output the gate st ate. if the in and the out1h/l pin are at the same level, the osfb pin output the ?hi-z? level, otherwise the osfb pin output the ?l? level and hold ?l? until ena=h or uvlo on low voltage side is activated. description of functions and examples of constant setting 1) miller clamp function when out1h/l=hi-z/l and proout pin voltage < v out2on (typ 2v), h is output from out2 pin and the external mos switch is turned on. when out1h/l=h/hi-z, l is output fr om out2 pin and the external mos switch is turned off. while the short-circuit protection function is activated, l is output from out2 pin and the external mos switch is turned off. - + predriv er predriv er predriv er vcc2 out1h/l proout gnd2 vee2 v out2on predriv er predriv er out2 regulator vreg - + - + predriv er predriv er predriv er proout gnd2 vee2 predriv er predriv er out2 regulator vreg - + - + predriv er predriv er predriv er proout gnd2 vee2 predriv er predriv er out2 regulator vreg - + - + predriv er predriv er predriv er proout gnd2 vee2 predriv er predriv er out2 regulator vreg logic logic logic logic short current scpin in proout out2 detected not less than v scdet x x l not detected x l not less than v out2on l x l less than v out2on h x h x l figure 3. block diagram of miller clamp function. figure 4. timing chart of miller clamp function v out2on in out1h/l proout (monitor the gate voltage) out2 t poff (typ 115ns) t pon (typ 115ns) t out2on (typ 25ns)
5/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 2) fault status output this function is used to output a fault signal from the flt pin when a fault occurs (i.e., when the undervoltage lockout function (uvlo) or short current protection function (scp) is activated) and hold the fault signal until the set fault output holding time is completed. the fault output holding time t fltrls is given as the following equation with the settings of capacitor c fltrls and resistor r fltrls connected to the fltrls pin. for example, when c fltrls is set to 0.01 ? f and r fltrls is set to 200k ? , the holding time will be set to 2 ms. t fltrls [ms]= c fltrls [f]?r fltrls [k ? ] to set the fault output holding time to ?0? ms, only connect the resistor r fltrls . status flt pin normal hi-z fault occurs l 3) undervoltage lockout (uvlo) function the BM6104FV-C incorporates the undervoltage lockout (uvlo) function both on the low and the high voltage sides. when the power supply voltage drops to the uvlo on voltage (low voltage side typ 3.4v, high voltage side typ 9.05v), the out1 and the flt pin both will output the ?l? signal. when the power supply voltage rises to the uvlo off voltage (low voltage side typ 3.5v, high voltage side typ 9.55v), thes e pins will be reset. however, during the fault output holding time set in ?2) fault status output? section, the out1 pin a nd the flt pin will hold the ?l? signal. in addition, to prevent malfunctions due to noises, mask time t uvlo1msk (typ 10s) and t uvlo2msk (typ 10s) are set on both low and high voltage sides. in l h vcc2 v uvlo2h v uvlo2l flt hi-z l out1h/l l h hi-z figure 8. high voltage side uv lo operation timing chart figure 7. low voltage side uvlo function operation timing chart vcc1 v uvlo1h v uvlo1l flt hi-z l out1h/l l h l h in figure 6. fault output block diagram figure 5. fault status output timing chart flt hi-z l out1h/l l h v fltrls fltrls fault output holding time (t fltrls ) status fault occurs (the uvlo or scp function is activated.) r s r s - + - + uvlo flt scp ecu v cc1 fltrls flt gnd1 r fltrls c fltrls
6/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 4) short current protection function (scp, desat) when the scpin pin voltage exceeds v scdet (typ 0.7v), the scp function will be activated. when the scp function is activated, the out1h/l pin voltage will be set to the ?hi-z/hiz? level first, and then the proout pin voltage to the ?l? level (soft turn-off).next, after t sto (min 30s, max 110s) has passed after the short-circuit current falls below the threshold value, out1h/l pin becomes hiz/l and proout pin becomes l. finally, when the fault output holding time set in ?2) fault status output? section on page 5 is completed, the scp function will be released. v collector /v drain which desaturation protection starts operation (v desat ) and the blanking time (t blank ) can be calculated by the formula below; figure 9. block diagram for desat v desat reference value r1 r2 r3 4.0v 15 k ? 39 k ? 6.8 k ? 4.5v 15 k ? 43 k ? 6.8 k ? 5.0v 15 k ? 36 k ? 5.1 k ? 5.5v 15 k ? 39 k ? 5.1 k ? 6.0v 15 k ? 43 k ? 5.1 k ? 6.5v 15 k ? 62 k ? 6.8 k ? 7.0v 15 k ? 68 k ? 6.8 k ? 7.5v 15 k ? 82 k ? 7.5 k ? 8.0v 15 k ? 91 k ? 8.2 k ? 8.5v 15 k ? 82 k ? 6.8 k ? 9.0v 15 k ? 130 k ? 10 k ? 9.5v 15 k ? 91 k ? 6.8 k ? 10.0v 15 k ? 130 k ? 9.1 k ? scpmask logic r1 r2 r3 v scdet vcc2 out1h/l proout scpin gnd2 + - + - s r q v fltrls vcc1 fltrls flt gnd2 d1 c blank vee2 ?? ?? ?? 6 2 12 outernal 2 102.0) 3 123 1ln()1024 (3 123 12 3 123 3 23 1 ? ? ??? ?? ?????? ?? ? ?? ?? ?? ? ? ?? cc scdet blank blank scdet cc f scdet desat v v r rrr cr rrr rr st r rrr vvv v r rr vvv min d
7/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 10. desat operation timing chart figure 11. scp operation timing chart (note 1): ?2) fault status output? section on page 5 in out1h/l out2 proout scpin v scpth v scpth (typ 0.95 s) t blankouternal t blankouternal t blan t blan in out2 proout scpin flt v v t scpmsk + t comp_delay t blank t blank t scpmsk + t comp_delay fault output holding time (n o t e 1) flt proout scpin out1 ina hi-z l hi-z l v scdet l hi-z h h l t sto out2 hi-z h l fault output holding time (n o t e 1) t sto
8/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 12. scp operation status transition diagram v scpin >v scdet ye s no start out1h/l=hi-z/hi-z out2=l proout=l flt=l exceed mask time ye s no v fltrls >v tfltrls ye s no in=h ye s no v scpin 9/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 5 i/o condition table no . status input output vcc1 vcc2 s c p i n e n a i n b i n a p r o o u t o u t 1 h o u t 1 l o u t 2 p r o o u t f l t o s f b 1 scp h l l h x hi-z hi-z l l l hi-z 2 vcc1uvlo uvlo x l x x x h hi-z l l hi-z l hi-z 3 uvlo x l x x x l hi-z l h hi-z l hi-z 4 vcc2uvlo x uvlo l x x x h hi-z l l hi-z l hi-z 5 x uvlo l x x x l hi-z l h hi-z l hi-z 6 disable l h x x h hi-z l l hi-z hi-z hi-z 7 l h x x l hi-z l h hi-z hi-z hi-z 8 inb active l l h x h hi-z l l hi-z hi-z l 9 l l h x l hi-z l h hi-z hi-z hi-z 10 normal operation l input llllhhi-z l l hi-zhi-z l 11 lllllhi-z l h hi-zhi-zhi-z 12 normal operation h input l l l h h h hi-z l hi-z hi-z hi-z 13 l l l h l h hi-z l hi-z hi-z l : vcc1 or vcc2 > uvlo, x:don't care
10/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 6) power supply startup / shutoff sequence figure 14. power supply startup / shutoff sequence out1h/l proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2h v uvlo1l v uvlo2h v uvlo1l v uvlo2h v uvlo1l 0v 0v 0v out2 l hi-z h out1h/l proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2h v uvlo1l v uvlo2l v uvlo1h v uvlo2l v uvlo1h 0v 0v 0v out2 l hi-z h out1h/l proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2h v uvlo1l v uvlo2h v uvlo1l v uvlo2l v uvlo1h 0v 0v 0v out2 l hi-z h out1h/l proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2l v uvlo1h v uvlo2l v uvlo1h v uvlo2l v uvlo1h 0v 0v 0v out2 l hi-z h : since the vcc2 to vee2 pin voltage is low and the output mos does not turn on, the output pins become hi-z conditions. : since the vcc1 pin voltage is low and the flt output mos does not turn on, the output pins become hi-z conditions.
11/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 absolute maximum ratings (note 1) relative to gnd1. (note 2) relative to gnd2. (note 3) should not exceed pd and tj=150 ? c. (note 4) derate above ta=25 ? c at a rate of 9.5mw/ ? c. mounted on a glass epoxy of 70 mm ? 70 mm ? 1.6 mm. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating ratings parameter symbol min max units input-side supply voltage (note 5) v cc1 4.5 5.5 v output-side positive supply voltage (note 6) v cc2 10 24 v output-side negative supply voltage (note 6) v ee2 -12 0 v maximum difference between output-side positive and negative voltages v max2 10 32 v (note 5) relative to gnd1. (note 6) relative to gnd2. insulation related characteristics parameter symbol characteristic units insulation resistance (v io =500v) r s >10 9 ? insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limits unit input-side supply voltage v cc1 -0.3 :* +7.0 (note 1) v output-side positive supply voltage v cc2 -0.3 :* +30.0 (note 2) v output-side negative supply voltage v ee2 -15.0 :* +0.3 (note 2) v maximum difference between output-side positive and negative v oltages v max2 36.0 v ina, inb, ena pin input voltage v in -0.3 :* +vcc1+0.3 or 7.0 (note 1) v osfb, flt pin input voltage v flt -0.3 :* +vcc1+0.3 or 7.0 (note 1) v fltrls pin input voltage v fltrls -0.3 :* +vcc1+0.3 or 7.0 (note 1) v scpin pin input voltage v scpin -0.3~vcc2+0.3 (note 2) v vreg pin output current i vreg 10 ma out1h, out1l, proout pin output current (peak 10 s) i out1peak 5.0 (note 3) a out2 pin output current (peak 10 s) i out2peak 1.0 (note 3) a osfb output current i osfb 10 ma flt output current i flt 10 ma power dissipation p d 1.19 (note 4) w operating temperature range t opr -40 :* +125 c storage temperature range t stg -55 :* +150 c junction temperature t jmax +150 c
12/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 electrical characteristics unless otherwise specified t a =-40c~125c, v cc1 =4.5v~5.5v, v cc2 =10v~24v, v ee2 =-12v~0v parameter symbol min typ max unit conditions general input side circuit current 1 i cc11 0.38 0.51 0.64 ma out1=l input side circuit current 2 i cc12 0.38 0.51 0.64 ma out1=h input side circuit current 3 i cc13 0.47 0.62 0.77 ma ina=10khz, duty=50% input side circuit current 4 i cc14 0.54 0.72 0.90 ma ina=20khz, duty=50% output side circuit current 1 i cc21 1.5 2.0 2.5 ma vcc2=14v, out1=l output side circuit current 2 i cc22 1.3 1.8 2.3 ma vcc2=14v, out1=h output side circuit current 3 i cc23 1.6 2.2 2.8 ma vcc2=18v, out1=l output side circuit current 4 i cc24 1.3 1.9 2.5 ma vcc2=18v, out1=h output side circuit current 5 i cc25 1.8 2.5 3.2 ma vcc2=24v, out1=l output side circuit current 6 i cc26 1.5 2.1 2.7 ma vcc2=24v, out1=h logic block logic high level input voltage v inh 2.0 - v cc1 v ina, inb, ena logic low level input voltage v inl 0 - 0.8 v ina, inb, ena logic pull-down resistance r ind 25 50 100 k ? ina, inb logic pull-up resistance r inu 25 50 100 k ? ena logic input mask time t inmsk - - 90 ns ina, inb ena mask time t enamsk 4 10 20 s ena output out1h on resistance r onh 0.7 1.8 4.0 ? i out1h =40ma out1l on resistance r onl 0.4 0.9 2.0 ? i out1l =40ma out1 maximum current i outmax 3.0 4.5 - a vcc2=18v guaranteed by design proout on resistance r onpro 0.4 0.9 2.0 ? i proout =40ma turn on time t pona 90 115 150 ns ina=pwm, inb=l t ponb 100 125 160 ns ina=h, inb=pwm turn off time t poffa 90 115 150 ns ina=pwm, inb=l t poffb 80 105 140 ns ina=h, inb=pwm propagation distortion t pdista -25 0 20 ns t poffa - t pona t pdistb -45 -20 0 ns t poffb - t ponb rise time t rise - 50 - ns 10nf between out1-vee2 fall time t fall - 50 - ns 10nf between out1-vee2 out2 on resistance (source) r on2h 2.0 4.5 9.0 ? i out2 =10ma out2 on resistance (sink) r on2l 1.5 3.5 7.0 ? i out2 =10ma out2 on threshold voltage v out2on 1.8 2 2.2 v relative to vee2 out2 output delay time t out2on - 25 50 ns vreg output voltage v reg 9 10 11 v relative to vee2 common mode transient immunity cm 100 - - kv/s design assurance
13/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 electrical characteristics unless otherwise specified t a =-40c~125c, v cc1 =4.5v~5.5v, v cc2 =10v~24v, v ee2 =-12v~0v protection functions vcc1 uvlo off voltage v uvlo1h 3.35 3.50 3.65 v vcc1 uvlo on voltage v uvlo1l 3.25 3.40 3.55 v vcc1 uvlo mask time t uvlo1msk 4 10 30 s vcc2 uvlo off voltage v uvlo2h 8.95 9.55 10.15 v vcc2 uvlo on voltage v uvlo2l 8.45 9.05 9.65 v vcc2 uvlo mask time t uvlo2msk 4 10 30 s scpin input voltage v scpin - 0.1 0.22 v i scpin =1ma scp threshold voltage v scdet 0.665 0.700 0.735 v scp detection mask time t scpmsk 0.55 0.8 1.05 s soft turn off release time t sto 30 110 s osfb threshold voltage h v osfbh 4.5 5.0 5.5 v respective to gnd2 osfb threshold voltage l v osfbl 4.0 4.5 5.0 v respective to gnd2 osfb output low voltage v osfbol - 0.18 0.40 v i osfb =5ma osfb filter time t osfbon 1.5 2.0 2.6 s flt output low voltage v fltl - 0.18 0.40 v i flt =5ma fltrls threshold v tfltrls 0.64v cc1 -0.1 0.64v cc1 0.64v cc1 +0.1 v figure 15. ina-out1 timing chart ina out1h/l t rise t fall t pon t poff 50% 50% 90% 50% 50% 90% 10% 10%
14/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 typical performance curves figure 16. input side circuit current vs. vcc1 (out1=l) 0.38 0.51 0.64 4.50 4.75 5.00 5.25 5.50 vcc1 [v] input side circuit current [ma] 0.38 0.51 0.64 -40-20 0 20406080100120 ta [c] input side circuit current [ma] figure 17. input side circuit current vs. temperature (out1=l) figure 18. input side circuit current vs. vcc1 (out1=h) figure 19. input side circuit current vs. temperature (out1=h) 0.38 0.51 0.64 4.50 4.75 5.00 5.25 5.50 vcc1 [v] input side circuit current [ma] 0.38 0.51 0.64 -40-20 0 20406080100120 ta [c] input side circuit current [ma] ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v
15/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 20. input side circuit current vs. vcc1 (ina=10 khz, duty=50%) figure 21. input side circuit current vs. temperature (ina=10 khz, duty=50%) 0.47 0.52 0.57 0.62 0.67 0.72 0.77 4.50 4.75 5.00 5.25 5.50 vcc1 [v] input side circuit current [ma] 0.47 0.52 0.57 0.62 0.67 0.72 0.77 -40-20 0 20406080100120 ta [c] input side circuit current [ma] figure 22. input side circuit current vs. vcc1 (ina=20 khz, duty=50%) figure 23. input side circuit current vs. temperature (ina=20 khz, duty=50%) 0.54 0.59 0.64 0.69 0.74 0.79 0.84 0.89 4.50 4.75 5.00 5.25 5.50 vcc1 [v] input side circuit current [ma] 0.54 0.59 0.64 0.69 0.74 0.79 0.84 0.89 -40-20 0 20406080100120 ta [c] input side circuit current [ma] ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v
16/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 24. output side circuit current vs. vcc2 (out1=l) figure 25. output side circuit current vs. temperature (out1=l) 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 14 16 18 20 22 24 vcc2 [v] output side circuit current [ma] 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 -40-200 20406080100120 ta [c] output side circuit current [ma] figure 26. output side circuit current vs. vcc2 (out1=h) figure 27. output side circuit current vs. temperature (out1=h) 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 14 16 18 20 22 24 vcc2 [v] output side circuit current [ma] 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 -40-200 20406080100120 ta [c] output side circuit current [ma] ta=125c ta=25c ta=-40c vcc2=24v vcc2=18v vcc2=14v ta=125c ta=25c ta=-40c vcc2=24v vcc2=18v vcc2=14v
17/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 28. logic (ina/inb/ena) high/low level input voltage vs. vcc1 figure 29. out1 vs. ina input voltage (vcc1=5v, vcc2=18v, ta=25c) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] v inh / v inl [v] 0 4 8 12 16 20 24 012345 ina [v] out 1 [v] figure 30. logic pull-down resistance vs. vcc1 figure 31. logic pull-up resistance vs. vcc1 25.0 50.0 75.0 100.0 4.50 4.75 5.00 5.25 5.50 vcc 1 [v] r inu [k ] 25.0 50.0 75.0 100.0 4.50 4.75 5.00 5.25 5.50 vc c1 [ v] r ind [k ] ta=125c ta=25c ta=-40c ta=125c ta=25c ta=-40c ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c h level l level
18/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 32. logic (ina/inb) input mask time vs. vcc1 (high pulse) figure 33. logic (ina/inb) input mask time vs. vcc1 (low pulse) 0 10 20 30 40 50 60 70 80 90 4.50 4.75 5.00 5.25 5.50 vcc1 [v] t inmsk [ns] 0 10 20 30 40 50 60 70 80 90 4.50 4.75 5.00 5.25 5.50 vc c1 [ v] t inmsk [ns] figure 34. ena mask time vs. vcc1 4 8 12 16 20 4.50 4.75 5.00 5.25 5.50 vc c1 [ v] t enamsk [s] figure 35. out1h on resistance vs. vcc2 0.7 1.3 1.9 2.5 3.1 3.7 14 16 18 20 22 24 vcc2 [v] r onh [ ] ta=-40c ta=25c ta=125c ta=125c ta=25c ta=-40c ta=125c ta=25c ta=-40c ta=125c ta=25c ta=-40c
19/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 36. out1l on resistance vs. vcc2 0.4 0.8 1.2 1.6 2.0 14 16 18 20 22 24 vcc2 [v] r onl [ ] figure 37. proout on resistance vs. vcc2 0.4 0.8 1.2 1.6 2.0 14 16 18 20 22 24 vcc2 [v] r onpro [ ] figure 38. turn on time vs vcc2 (ina=pwm, inb=l) 90 100 110 120 130 140 150 14 16 18 20 22 24 vcc2 [v] t pon [ns] ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c figure 39. turn on time vs temperature (vcc2=24v, ina=pwm, inb=l) 90 100 110 120 130 140 150 -40-200 20406080100120 ta [c] t pon [ns] ta=25c ta=125c ta=-40c
20/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 40. turn off time vs. vcc2 (ina=pwm, inb=l) 90 100 110 120 130 140 150 14 16 18 20 22 24 vcc2 [v] t poff [ns] figure 42. rise time vs. vcc2 (10nf between out1-vee2) 0 10 20 30 40 50 60 70 80 90 100 14 16 18 20 22 24 vcc2 [v] t ri se [ns] figure 43. fall time vs. vcc2 (10nf between out1-vee2) 0 10 20 30 40 50 60 70 80 90 100 14 16 18 20 22 24 vcc2 [v] t fall [ns] ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c figure 41. turn off time vs. temperature (vcc2=24v, ina=pwm, inb=l) 90 100 110 120 130 140 150 -40-200 20406080100120 ta [c] t poff [ns] ta=25c ta=-40c ta=125c
21/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 0 10 20 30 40 50 14 16 18 20 22 24 vc c2 [v] t out2on [ns] figure 44. out2 on resistance (source) vs. vcc2 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 14 16 18 20 22 24 vcc2 [v] r on2h [ ] figure 45. out2 on resistance (sink) vs. vcc2 1.5 2.5 3.5 4.5 5.5 6.5 14 16 18 20 22 24 vcc2 [v] r on2l [ ] figure 46. out2 on threshold voltage vs. vcc2 1.8 1.9 2.0 2.1 2.2 14 16 18 20 22 24 vcc2 [v] v out2on [v] figure 47. out2 output delay time vs. vcc2 ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c ta=125c ta=25c ta=-40c
22/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 48. vreg output voltage vs. vcc2 9.0 9.5 10.0 10.5 11.0 14 16 18 20 22 24 vcc 2 [v] v re g [v] figure 49. vreg output voltage vs. temperature 9.0 9.5 10.0 10.5 11.0 -40-20 0 20406080100120 ta [c] v re g [v] figure 50. flt vs. vcc1 (vcc1 uvlo on/off voltage) 0 1 2 3 4 5 3.25 3.35 3.45 3.55 3.65 vc c1 [ v] flt [v] figure 51. vcc1 uvlo mask time vs. temperature 4 8 12 16 20 24 28 -40-200 20406080100120 ta [c] t uv lo1msk [s] ta=-40c ta=25c ta=125c vcc2=24v vcc2=18v vcc2=14v ta=25c ta=125c ta=-40c ta=25c ta=125c ta=-40c
23/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 52. flt vs. vcc2 (vcc2 uvlo on/off voltage, vcc1=5v) 0 1 2 3 4 5 6 8.6 9.1 9.6 vc c2 [ v] flt [v] figure 53. vcc2 uvlo mask time vs. temperature 4 8 12 16 20 24 28 -40-200 20406080100120 ta [c] t uv lo2msk [s] figure 54. scpin input voltage vs. vcc2 (iscpin=1ma) 0.00 0.11 0.22 14 16 18 20 22 24 vcc 2 [v] v scpin [v] figure 55. scp threshold voltage vs. vcc2 0.67 0.70 0.73 14 16 18 20 22 24 vcc 2 [v] v scdet [v] ta=25c ta=125c ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=-40c ta=125c
24/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 56. scp detection mask time vs. vcc2 0.55 0.65 0.75 0.85 0.95 1.05 14 16 18 20 22 24 vcc2 [v] t scpmsk [s] figure 57. soft turn off release time vs. temperature 30 50 70 90 110 -40-200 20406080100120 ta [c] t sto [s] figure 58. osfb threshold voltage h/l vs. vcc2 4.00 4.20 4.40 4.60 4.80 5.00 5.20 5.40 14 16 18 20 22 24 vcc 2 [v] v osfb [v] figure 59. osfb output low voltage vs. vcc2 (iosfb=5ma) ta=-40c ta=125c ta=25c vcc2=14v vcc2=18v vcc2=24v max. min. vcc2=14v vcc2=18v vcc2=24v 0.0 0.1 0.2 0.3 0.4 4.50 4.75 5.00 5.25 5.50 vcc2 [v] v osfbol [v] ta=-40c ta=125c ta=25c osfb_h osfb_l ta=25c ta=125c ta=-40c ta=125c ta=-40c ta=25c
25/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 figure 60. osfb filter time vs. vcc1 figure 61. flt output low voltage vs. vcc2 (iflt=5ma) 0.0 0.1 0.2 0.3 0.4 4.50 4.75 5.00 5.25 5.50 vcc2 [v] v fltl [v] ta=-40c ta=125c ta=25c figure 62. fltrls threshold vs. vcc1 2.78 2.99 3.20 3.41 3.62 4.50 4.75 5.00 5.25 5.50 vcc1 [v] v tfltrls [v] ta=-40c ta=25c ta=125c 1.50 1.70 1.90 2.10 2.30 2.50 4.50 4.75 5.00 5.25 5.50 vcc1 [v] t osfbon [s] ta=125c ta=-40c ta=25c
26/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 selection of components externally connected figure 63. for using 4-pin igbt (for using scp function) figure 64. for using 3-pin igbt (for using desat function) proout vee2 out1l out1h vcc2 vreg out2 gnd2 vee2 scpin gnd1 osfb inb fltrls vcc1 flt ina ena test gnd1 s q r uvlo flt time r logic s q r fb regulator + - uvlo latch ina ena + - + - logic proout vee2 out1l out1h vcc2 vreg out2 gnd2 vee2 scpin gnd1 osfb inb fltrls vcc1 flt ina ena test gnd1 s q r uvlo flt time r logic s q r fb + - + - re g ulato r + - uvlo logic latch ina ena recommended rohm rsr025n03 rss065n03 recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm rsr025n03 rss065n03 recommended rohm mcr03ezp 1 p in 1 p in
27/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 power dissipation thermal design please confirm that the ic?s chip temper ature tj is not over 150c, while consid ering the ic?s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded, the functions as a semiconductor do not operate and some problems (ex. abnormal o peration of various parasitic elements an d increasing of leak current) occur. constant use under these circumstances leads to deterioration a nd eventually ic may destruct. tjmax=150c must be strictly followed under all circumstances. figure 65. ssop-b20w derating curve 0 25 50 75 100 125 150 0 0.5 1.0 1.5 1.19 w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature: ta [c] power dissipation:pd [w] measurement machine th156 kuwano electric measurement condition rohm board board size 7070 1.6mm 3 1-layer board ja =105.3c/w
28/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 i/o equivalence circuits pin no. name i/o equivalence circuits function 1 scpin vcc2 scpin vee2 gnd2 short current detection pin 4 out2 vee2 vcc2 out2 vreg internal pow er supply mosfet control pin for miller clamp 5 vreg power supply pin for driving mosfet for miller clamp 7 out1h out1h vee2 vcc2 out1l source side output pin 8 out1l sink side output pin 10 proout proout vee2 vcc2 vreg soft turn-off pin internal power supply internal power supply
29/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 pin no. name i/o equivalence circuits function 12 osfb osfb gnd1 output state feedback pin 14 fltrls fltrls gnd1 vcc1 fault output holding time setting pin 16 flt flt gnd1 fault output pin 13 inb ina inb gnd1 vcc1 control input pin b 17 ina control input pin a
30/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 pin no. name i/o equivalence circuits function 18 ena ena gnd1 vcc1 input enabling signal input pin 19 test test gnd1 vcc1 test mode setting pin
31/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and su pply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ens ure that the ground traces of exter nal components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a ca pacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removi ng it from the test setup duri ng the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
32/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 11. unused input terminals input terminals of an ic are often connected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conducti on through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused i nput terminals should be connected to the power supply or ground line. 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 66. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others.
33/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 ordering information b m 6 1 0 4 f v - ce 2 part number package fv:ssop-b20w rank c:automotive packaging and forming specification e2: embossed tape and reel marking diagram ssop-b20w (top view) bm6104 part number marking lot number 1pin mark
34/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 physical dimension, tape and reel information package name ssop-b20w ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
35/35 datasheet datasheet BM6104FV-C tsz02201-0717abh00030-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 23.jan.2014 rev.002 revision history date revision changes 06.nov.2013 001 new release 23.jan.2014 002 page 13 : change electrical c haracteristics ' vcc2 uvlo off voltage ' page 13 : change electrical characteristics ' vcc2 uvlo on voltage ' page 26 : change selection of components externally connected
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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